By: Mr. Renato Layug
Senior Technical Product Specialist
The new trend of board design is more on QFN package with BGA. The common problem on this type of component design is the excessive solder voids. Based on studies, the occurrence of these solder voids is very detrimental because it affects much on the reliability of the soldered joints at more than 25%.
The solution of Qualitek on this problem is on the solder paste formulation. Qualitek DSP865A was proven effective on reducing the solder voids using an optimum temperature profile. The flux chemistry of this flux is unique and designed for common Lead-free process. For more information about this solder paste and product evaluation, please contact us!